Stock code: 300151, SZ
R&D AND Technology
Semiconductor Consumables
As pioneers of industrial intelligence, we deliver precision-engineered components for printers, copiers, tablets, smart audio systems, and logisticsrobots, while extending expertise to automotive manufacturing, smart home ecosystems, educational tech, medical devices, and specialized R&D in intelligent logistics and electronic components. Powered by micron-level manufacturing excellence, we drive industry evolution through intelligent productivity innovation.
Article:
HWS
Material:
Polycarbonate
Weight:
1.2KG
Wall Thickness:
2.8mm
Hot Runner System:
Mold:
Injection Molding
Cavities:
1*1
Article:
FOUP
Material:
Cyclo Olefin Polymer
Weight:
4.8KG
Wall Thickness:
3.8mm
Hot Runner System:
Needle Valve
Mold:
Injection Molding
Cavities:
1*1
Article:
FOSB
Material:
Polycarbonate (Ultra Pure)
Weight:
4.9KG
Wall Thickness:
3.8mm
Hot Runner System:
Needle Valve
Mold:
Injection Molding
Cavities:
1*1
Article:
200L electronic grade ultra-clean drum
Material:
HDPE
Weight:
12.5KG
Wall Thickness:
Hot Runner System:
Mold:
Blow Molding
Cavities:
1*1
Article:
Membrane
Material:
silicon
Weight:
0.5mm
Wall Thickness:
300mm
Hot Runner System:
Mold:
Injection Molding
Cavities:
1*1
1